ADVANCE CIRCUIT DESIGNS CENTRE SDN BHD

Laser Stencil Specifications

Postion Tolerance +/- 0.0003 inch
Aperture Opening Tolerance +/- 0.0002 inch
All opening walls are trapezoidal 0.8 mil Taper

Laser Cutting Service
for metal plates with high accuracy (New!)

We now provide this service for metal plates
of any material ranging from
Size : 10mm square to 600mm square
Max upto 2 mm in thickness

Turn-around-time : 1 hour upon full information given

Framed In Cast Aluminium Or Tubular: As with all our stencils, we provide nearly ALL frame sizes custom made to suit your requirements.	Multi - Level Stencils: Multi - level stencils are an invaluable solution for a number of applications, such as assemblies requiring different foil thickness due to mixture of component sizes, coplanarity issues, through-hole reflow, epoxy / paste applications among others. Contact us to find out how multi - level stencils can help your project.
Mini - Stencils: Used for placing solder paste on the pads of components being reworked. ACDC has the capability of creating REWORK STENCILS for all types of components like BGA, using either Gerber Data or mechanical drawings.	Reballing Fixtures: An economical tool for reballing BGA's during the rework process, saving our customers both time and money.
Metal Squeegee Blades: With extensive experience, we at ACDC can design and manufacture GOOD QUALITY Squeesee Blades for consistant fine pitch printing ability.	Inspection Templates: An invaluable tool in the INSPECTION of printed circuit boards for MISSING or MISALIGNED components. All these templates are ANTI - STATIC coated. Contact us to find out how inspection templates can help your production.
Photo - Plotting: In - house photo plotting enables us to offer "QUICK TURN" services and extended at competitive prices. Photo - plottings are done at 8000DPI and are on 7 mils film.

Stencil Aperture Design:
	DOGBONE OPENING: A modification that can be applied in two different situations. For fine pitch, it reduces solder in the middle on the pad to reduce bridging but gives more volume on the ends for good fillets. I can also be used when re flowing double side SMT connectors.
	HOMEBASE OPENINGS: The most common shape used when trying to keep paste away from the components body in order to eliminate solder balls when using a no - clean solder paste.
	STEPDOWN / MULTI LEVEL: The only cost / time effective method of printing different paste heights using the same stencil. Commonly used when dealing with BGA's to prevent coplanarity issues.
	EPOXY DESIGNS: A service which has been provided and perfected since ACDC's inception. Stencils openings are designed to deposit just the right amount of glue to hold the components during wave solder process.